Heat-Resistant Epoxy Electronic Potting Sealant

FEATURES

SUPERIOR HEAT RESISTANCE: Withstands high temperatures without degrading, ensuring the integrity and performance of electronic components under extreme thermal conditions.

EXCELLENT ELECTRICAL INSULATION: Provides a reliable insulating layer to prevent short circuits, safeguarding sensitive electronics from electrical interference and damage.

EXCEPTIONAL ADHESION: Bonds strongly to various surfaces, including metal, plastic, and ceramic, ensuring a secure and durable seal that withstands mechanical stress.

MOISTURE AND CHEMICAL RESISTANT: Effectively shields electronics from moisture, dust, and harsh chemicals, extending the lifespan and reliability of the components.

EASY TO USE: Features a convenient two-part system that mixes smoothly and cures quickly, allowing for efficient application and minimal downtime.

SPEC

Ingredients: Epoxy Resin 139A, Hardener 139B

Curing Time:

25°C: Surface dry in 6-8 hours, fully cured in 12-16 hours

60-80°C: Cured in 1.5-2 hours

Mixing Ratio: A:B = 5:1

Heat Distortion Temperature: 100-120°C

Low Temperature Resistance: -25°C

Tensile Strength: 16-18 kg/cm²

Compressive Strength: 18-22 kg/cm²

Surface Resistivity: 1.2 × 10¹⁴ Ω·cm

Volume Resistivity: 1.1 × 10¹⁵ Ω·cm

Package includes: 1 * Heat-Resistant Epoxy Electronic Potting Sealant （AB solution）

NOTES

Work in a well-ventilated area and use protective gloves during application.

Store in a cool, dry place to maintain product quality.